- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98201 > TDA8754HL/21 (NXP SEMICONDUCTORS) 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 PDF資料下載
參數(shù)資料
| 型號： | TDA8754HL/21 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| 封裝： | 20 X 20 MM, 1.40 MM HEIGHT, LOW PROFILE, PLASTIC, SOT-486-1, MS-026, QFP-144 |
| 文件頁數(shù)： | 50/57頁 |
| 文件大?。?/td> | 264K |
| 代理商： | TDA8754HL/21 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁當前第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁
9397 750 14984
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2005
54 of 57
Philips Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msps
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
相關PDF資料 |
PDF描述 |
|---|---|
| TDA8754EL/21 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
| TDA8754HL/11 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8754EL/11 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
| TDA8754HL/17 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8754EL/17/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8754HL21BE-S | 功能描述:視頻模擬/數(shù)字化轉換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8754HL21BE-T | 功能描述:視頻模擬/數(shù)字化轉換器集成電路 3X8 BIT VIDEO A/D-210 MSPS RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8754HL27BE-S | 功能描述:視頻模擬/數(shù)字化轉換器集成電路 3X8 BIT VIDEO A/D-270 MSPS RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8755 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface |
| TDA8755T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface |
發(fā)布緊急采購，3分鐘左右您將得到回復。