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參數(shù)資料
| 型號： | TDA8754EL/17/C1 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
| 封裝： | 17 X 17 MM, 1.05 MM HEIGHT, PLASTIC, MO-192, SOT774-1, LBGA-208 |
| 文件頁數(shù)： | 49/57頁 |
| 文件大小： | 259K |
| 代理商： | TDA8754EL/17/C1 |
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TDA8754_7
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 3 May 2007
53 of 57
NXP Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msample/s
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 77 and 78
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 13.
Table 77.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 78.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| TDA8754EL/14/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
| TDA8754EL/21/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208 |
| TDA8754HL/17/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8754HL/21/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8754HL/27/C1 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8754H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed ADC for LCD drive |
| TDA8754HL/11/C1,51 | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8754HL/11/C1,55 | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8754HL/11/C1/R1 | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8-BIT VID INTERFACE 110 MSPS RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TDA8754HL/11/C1/R1,518 | 制造商:NXP Semiconductors 功能描述: |
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