參數(shù)資料
型號(hào)： TDA8034HN/C1
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQCC24
封裝： 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24
文件頁數(shù)： 5/30頁
文件大?。?/td> 265K
代理商： TDA8034HN/C1
TDA8034HN
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3.1. — 5 September 2011
13 of 30
NXP Semiconductors
TDA8034HN
Smart card interface
9.
Limiting values
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in Table 5 can cause permanent damage to
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
(1) Deactivation caused by card withdrawal.
(2) Deactivation caused by short-circuit.
Fig 10. Operation of debounce feature with pins OFFN, CMDVCCN, PRESN and VCC
001aal411
PRESN
OFFN
tdeb
CMDVCCN
VCC
(1)
(2)
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDP
power supply voltage
pin VDDP
0.3
+6
V
VDD
supply voltage
pin VDD
0.3
+4.6
V
VDD(INTF)
interface supply voltage
pin VDD(INTF)
0.3
+4.6
V
VI
input voltage
pins CMDVCCN, CLKDIV1, CLKDIV2,
VCC_SEL1, VCC_SEL2, RSTIN, OFFN,
PORADJ, XTAL1, XTAL2, I/OUC, AUX1UC,
AUX1UC
0.3
+4.6
V
card contact pins PRESN, I/O, RST, AUX1,
AUX2 and CLK
0.3
+6
V
Tstg
storage temperature
55
+150
C
Ptot
total power dissipation
Tamb = 25 C to +85 C
-
0.25
W
Tj
junction temperature
-
+125
C
Tamb
ambient temperature
25
+85
C
VESD
electrostatic discharge voltage
Human Body Model (HBM) on card pins I/O,
RST, VCC, AUX1, AUX2, CLK, PRESN;
within typical application
6+6
kV
Human Body Model (HBM); all other pins
2+2
kV
Machine Model (MM); all pins
200
+200
V
Field Charged Device Model (FCDM); all
pins
500
+500
V
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