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參數資料
| 型號： | TDA8034HN/C1 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQCC24 |
| 封裝： | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 |
| 文件頁數： | 16/30頁 |
| 文件大小： | 265K |
| 代理商： | TDA8034HN/C1 |
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TDA8034HN
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3.1. — 5 September 2011
23 of 30
NXP Semiconductors
TDA8034HN
Smart card interface
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 14) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 14.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TDA8034T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart card interface |
| TDA8034T/C1,112 | 功能描述:接口 - 專用 SMART CARD INTERFACE RoHS:否 制造商:Texas Instruments 產品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:BGA-59 |
| TDA8034T/C1,118 | 功能描述:接口 - 專用 SMART CARD INTERFACE RoHS:否 制造商:Texas Instruments 產品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:BGA-59 |
| TDA8035C1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart card interface externally by a resistor bridge |
| TDA8035HN | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart card interface externally by a resistor bridge |
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