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Preliminary Data Sheet
TDA21201
Page 8
Apr-29, 2002
frequencies will also result in more losses. So, in modifying the thermal
environment and a switching frequency the phase current can be matched
your requirements; please, consult the efficiency curves in this Data Sheet to
choose the most suitable phase current and switching frequency per phase for
a particular design. To give a circuit designer more freedom in scaling the
phase current, the Integrated Switch is offered in a heat sink capable TO-220
version that allows better thermal coupling to ambient and a higher junction
temperature in the Integrated Switch as well - without violating the applicable
regulations.
Over temperature shut-down
The over temperature shut-down function of the Integrated Switch takes effect
@ 150 °C junction temperature typically and turns off the High side MOSFET
and the Low side MOSFET. Unlike as in discrete converter solutions the
MOSFETs and the Driver are thermally very well coupled. Therefore, this
function protects the Driver and the MOSFETs. Once the Integrated Switch is
cooled down and the temperature shut-down is released the Integrated Switch
continues to operate by turning on one of the MOSFETs according to its PWM
signal present on the input.
Under Voltage Lockout /
Vcc detection
The TDA21201 is fully functional at Vcc
≥
9 V. However, the Low side
MOSFET can already be turned on at Vcc
≈
6 V or greater when the input is
Low. The Integrated Switch is disabled and both MOSFETs are turned off at
lower Vcc, e.g. during power-up of the ATX supply.
The TDA21201 has two paralleled Vcc pins. The voltage applied to these pins
will be converted to a lower output voltage but it also serves as supply voltage
of the integrated gate drive circuit. Therefore, the voltage difference
Vcc is
monitored for safety reasons. When
Vcc
≥
0.45 V for more than 2 μs
typically the Integrated Switch is disabled. This way it prevents the part itself
but it also protects the load from inadequate behavior, e.g. due to a bad
soldering connection of the Vcc pins.
Layout guidelines
In general, the layout is simplified when using the Integrated Switch. However,
it should be kept in mind that the power density in the Integrated Switch is
higher than in a discrete solution. Therefore, proper thermal layout is very
critical in designs that employ the SMD version.
Another important aspect is a very low impedance path in the Vcc = 12 V
à
TDA21201
à
GND loop. It is recommended to place the capacitors of the
input filter as close to the GND and Vcc pins of the TDA21201 as possible.
Additional ceramic capacitors in parallel to the input capacitors help to reduce
the effect of stray inductance of the input capacitors and the PCB traces.
Reducing parasitic inductance will result in an optimized switching behavior
and lower switching losses. The arrangement of the output filter is of second
order importance.