參數(shù)資料
型號(hào)： TB3R1LD
廠商： Texas Instruments, Inc.
英文描述： QUAD DIFFERENTIAL PECL RECEIVERS
中文描述： 四路差分PECL接收機(jī)
文件頁(yè)數(shù)： 2/11頁(yè)
文件大小： 267K
代理商： TB3R1LD
www.ti.com
POWER DISSIPATION RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TB3R1, TB3R2
SLLS587B–NOVEMBER 2003–REVISED MAY 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER
TB3R1D
TB3R2D
TB3R1LD
TB3R2LD
PART MARKING
TB3R1
TB3R2
TB3R1
TB3R2
Package
SOIC
SOIC
SOIC
SOIC
LEAD FIISH
NiPdAu
NiPdAu
SnPb
SnPb
STATUS
Production
Production
Production
Production
POWER RATING
T
A
≤
25
°
C
THERMAL RESISTANCE,
JUNCTION-TO-AMBIENT
WITH NO AIR FLOW
131.1
°
C/W
84.1
°
C/W
120.3
°
C/W
80.8
°
C/W
DERATING FAC-
TOR
(1)
T
A
≥
25
°
C
7.6 mW/
°
C
11.9 mW/
°
C
8.3 mW/
°
C
12.4 mW/
°
C
POWER RATING
T
A
= 85
°
C
CIRCUIT BOARD
MODEL
PACKAGE
Low-K
(1)
High-K
(2)
Low-K
(1)
High-K
(2)
763 mW
1190 mW
831 mW
1240 mW
305 mW
475 mW
332 mW
494 mW
D
DW
(1)
(2)
In accordance with the low-K thermal metric definitions of EIA/JESD51-3.
In accordance with the high-K thermal metric definitions of EIA/JESD51-7.
THERMAL CHARACTERISTICS
PARAMETER
PACKAGE
D
DW
D
DW
VALUE
47.5
53.7
44.2
47.1
UNIT
°
C/W
°
C/W
°
C/W
°
C/W
Junction-to-Board
Thermal Resistance
θ
JB
Junction-to-Case
Thermal Resistance
θ
JC
UNIT
0 V to 6 V
6.5 V
±
3 kV
±
2 kV
Supply voltage, V
CC
Magnitude of differential bus (input) voltage, |V
AI
- V|, |V
BI
- V|, |V
CI
- V|, |V
DI
- V|
Human Body Model
(2)
ESD
Charged-Device Model
(3)
Continuous power dissipation
Storage temperature, T
stg
All pins
All pins
See Dissipation Rating Table
-65
°
C to 150
°
C
(1)
Stresses beyond those listed under,, absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
(2)
(3)
2
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