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參數(shù)資料
| 型號： | TA2024 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | 運(yùn)動控制電子 |
| 英文描述： | Stereo 10W (4з) Class-T⑩ Digital Audio Amplifier using Digital Power Processing⑩ Technology |
| 中文描述： | 10W的立體聲（4з）類- T的數(shù)字音頻放大器⑩使用數(shù)字電源技術(shù)處理⑩ |
| 文件頁數(shù)： | 10/14頁 |
| 文件大?。?/td> | 467K |
| 代理商： | TA2024 |
T E C H N I C A L I N F O R M A T I O N
Page 10
TA2024 Preliminary, Rev. 1.0
Power Dissipation Derating
For operating at ambient temperatures above 25
°
C the device must be derated based on a 150
°
C
maximum junction temperature, T
JMAX
as given by the following equation:
JA
A
JMAX
T
DISS
P
)
T
(
θ
=
where…
P
DISS
= maximum power dissipation
T
JMAX
= maximum junction temperature of TA2024
T
A
= operating ambient temperature
θ
JA
= junction-to-ambient thermal resistance
Where
θ
JA
of the package is determined from the following graph:
In the above graph Copper Area is the size of the copper pad on the PC board to which the heat slug
of the TA2024 is soldered. The heat slug must be soldered to the PCB to increase the maximum
power dissipation capability of the TA2024 package. Soldering will minimize the likelihood of an over-
temperature fault occurring during continuous heavy load conditions. The vias used for connecting
the heatslug to the copper area on the PCB should be 0.013” diameter.
Θ
JA
vs Copper Area
10
20
30
40
50
0
1
2
3
4
5
6
Copper Area (square inches)
J
o
C
Pdiss - 1.35W
Pdiss - 2W
Pdiss - 3.4W
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