參數(shù)資料
型號: T35L6432B-10Q
廠商: TM Technology, Inc.
英文描述: 64K x 32 SRAM
中文描述: 64K的× 32的SRAM
文件頁數(shù): 8/16頁
文件大?。?/td> 162K
代理商: T35L6432B-10Q
TE
CH
tm
ABSOLUTE MAXIMUM RATINGS*
Voltage on VCC Supply Relative to VSS.
…………-0.5V to +4.6V
I/O Supply Voltage VccQ ........... Vss -0.5V to
Vcc
VIN......................................... -0.5V to Vcc +0.5V
Storage Temperature (plastic)...... -55
°
C to +150
°
C
Junction Temperature ..........….................. +150
°
C
Power Dissipation ........................................ 1.0W
Short Circuit Output Current...................... 100mA
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED
OPERATING CONDITIONS
(0
°
C
Ta
70
°
C; VCC = 3.3V (+0.3V/-0.165V) unless otherwise noted)
DESCRIPTION
CONDITIONS
Input High (Logic)
voltage
Input Low (Logic)
voltage
Input Leakage Current
0V
VIN
VCC
Output Leakage Current
Output(s) disabled, 0V
VOUT
VCC
Output High Voltage
IOH = -4.0 mA
Output Low Voltage
IOL = 8.0 mA
Supply Voltage
T35L6432B
Taiwan Memory Technology, Inc. reserves the right
P.8
to change products or specifications without notice.
Publication Date: JUL. 2002
Revision: A
*Stresses greater than those listed under
"Absolute
Maximum
Ratings"
permanent damage to the device. This is a stress
rating only and functional operation of the device
at these or any other conditions above those
indicated in the operational sections of this
specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect reliability.
may
cause
SYM.
VIH
MIN
2
MAX
UNITS
V
NOTES
1, 2
VCCQ + 0.3
VIL
-0.3
0.8
V
1, 2
ILI
ILO
-2
-2
2
2
uA
uA
14
VOH
VOL
Vcc
2.4
3.1
V
V
V
1, 11
1, 11
1
0.4
3.6
MAX.
DESCRIPTION
CONDITIONS
SYM. TYP
-9
-10 -11 -12 UNITS NOTES
Power Supply
Current : Operating
Device selected; all inputs
VIL or
VIH; cycle time
tKC MIN; VCC
= MAX; outputs open
ICC
TBD 250 200 150 120
mA
3, 12, 13
Power Supply
Current: Idle
Device selected;
ADSC
,
ADSP
,
ADV
,
GW
,
BWE
VIH; all other
inputs
VIL or
VIH; VCC = MAX;
cycle time
tKC MIN: outputs open
Device deselected; VCC = MAX; all
inputs
VSS + 0.2 or
VCC - 0.2;
all inputs static; CLK frequency =0
ISB1 TBD
60
60
60
60
mA
12, 13
CMOS Standby
ISB2 TBD
10
10
10
10
mA
12, 13
TTL Standby
Device deselected; all inputs
VIL
or
VIH; all inputs static; VCC =
MAX;CLK frequency = 0
Device deselected; all inputs
VIL
or
VIH; VCC =MAX; CLK cycle
time
tKCMIN
ISB3 TBD
25
25
25
25
mA
12, 13
Clock Running
ISB4 TBD
60
60
60
60
mA
12, 13
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