參數(shù)資料
型號(hào): T35L6432B-10Q
廠商: TM Technology, Inc.
英文描述: 64K x 32 SRAM
中文描述: 64K的× 32的SRAM
文件頁(yè)數(shù): 14/16頁(yè)
文件大?。?/td> 162K
代理商: T35L6432B-10Q
TE
CH
tm
READ/WRITE TIMING
T35L6432B
Taiwan Memory Technology, Inc. reserves the right
P. 14
to change products or specifications without notice.
Publication Date: JUL. 2002
Revision: A
C L K
A D S C
A D D R E S S
B W E
B W 1 -B W 4
C E
(N O T E 2 )
O E
D
t
K C
t
K H
t
K L
:D o n 't c a re
:U N D E F IN E D
A D S P
t
A D S S
t
A D S H
A 1
A D V
B a c k -to -B a c k R E A D s
B U R S T R E A D
Q
S in g le W R IT E
B a c k -to -B a c k
W R IT E s
t
A S
t
A H
A 2
A 3
A 4
A 5
A 6
t
W S
t
W H
t
C E S
t
C E H
t
D S
t
O E H Z
t
D H
t
K Q
t
O E L Z
H ig h - Z
Q (A 1 )
Q (A 2 )
Q (A 4 )
Q (A 4 + 1 )
Q (A 4 + 2 )
Q (A 4 + 3 )
D (A 6 )
D (A 5 )
D (A 3 )
(N O T E 1 )
Note:
1. Q(A4) refers to output from address A4. Q (A4 + 1) refers to output from the next internal burst
address following A4.
2.
CE2
and CE2 have timing identical to CE . On this diagram, when CE is LOW,
CE2
is
LOW and CE2 is HIGH. When CE is HIGH, CE2 is HIGH and CE2 is LOW.
3. The data bus (Q) remains in High-Z following a WRITE cycle unless an
ADSP
,
ADSC
or
ADV
cycle is performed.
4.
GW
is HIGH.
5. Back-to-back READs may be controlled by either
ADSP
or
ADSC
.
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