Supply Voltage" />
參數(shù)資料
型號(hào): SY89231UMG TR
廠商: Micrel Inc
文件頁(yè)數(shù): 10/15頁(yè)
文件大?。?/td> 0K
描述: IC CLOCK DIVIDER LVDS 16MLF
標(biāo)準(zhǔn)包裝: 1,000
系列: Precision Edge®
類型: 時(shí)鐘除法器
PLL: 無(wú)
輸入: CML,LVDS,PECL
輸出: LVDS
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 是/是
頻率 - 最大: 3.2GHz
除法器/乘法器: 是/無(wú)
電源電壓: 2.375 V ~ 2.625 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤,16-MLF?
供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
包裝: 帶卷 (TR)
Micrel, Inc.
SY89231U
November 2007
M9999-110507-A
hbwhelp@micrel.com or (408) 955-1690
4
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ..........................–0.5V to +4.0V
Input Voltage (VIN) ..................................–0.5V to VCC
LVPECL Output Current (IOUT)...……………....±10mA
Current (VT)
Source or sink current on VT .......………±100mA
Input Current
Source or sink current on (IN, /IN) ........... ±50mA
Current (VREF-AC)
Source/Sink Current on VREF-AC
(4) ............ ±0.5mA
Maximum Operating Junction Temperature…..125°C
Lead Temperature (soldering, 20 sec.) ..........+260°C
Storage Temperature (Ts)..................–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
θ
JA)
Still-Air ..................................................... 75°C/W
QFN (
ψ
JB)
Junction-to-Board………………………….33C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max VCC
71
95
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 2a. Note 6.
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 2b.
0.2
V
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
VT_IN
Voltage from Input to VT
1.8
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA and
ψ
JB values are determined for a 4-layer board in still air unless otherwise stated.
4. Due to limited drive capability use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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