參數(shù)資料
型號: STQ1NK60ZR
廠商: 意法半導體
英文描述: N-CHANNEL 600V 13 OHM 0.8A TO-92/IPAK/SOT-223 Zener-Protected SuperMESH MOSFET
中文描述: N溝道600V的13歐姆0.8A TO-92/IPAK/SOT-223齊納MOSFET的保護SuperMESH
文件頁數(shù): 2/14頁
文件大?。?/td> 657K
代理商: STQ1NK60ZR
STD1LNK60Z-1 - STQ1NK60ZR - STN1NK60Z
2/14
Table 3: Absolute Maximum ratings
Symbol
( ) Pulse width limited by safe operating area
(1) I
SD
0.3A, di/dt
200A/μs, V
DD
V
(BR)DSS
, T
j
T
JMAX.
Table 4: Thermal Data
(#) When mounted on 1 inch2 Fr-4 board, 2 Oz Cu
Table 5: Avalanche Characteristics
Symbol
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max)
E
AS
Single Pulse Avalanche Energy
(starting T
j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V)
Table 6: Gate-Source Zener Diode
Symbol
BV
GSO
Gate-Source Breakdown
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Parameter
Value
TO-92
Unit
IPAK
SOT-223
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
( )
P
TOT
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k
)
600
V
600
V
Gate- source Voltage
± 30
V
Drain Current (continuous) at T
C
= 25°C
Drain Current (continuous) at T
C
= 100°C
0.8
0.3
0.3
A
0.5
0.189
0.189
A
Drain Current (pulsed)
3.2
1.2
1.2
A
Total Dissipation at T
C
= 25°C
Derating Factor
Gate source ESD(HBM-C=100pF, R=1.5K
)
Peak Diode Recovery voltage slope
25
3
3.3
W
0.24
0.025
0.026
W/°C
V
ESD(G-S)
dv/dt (1)
T
j
T
stg
800
V
4.5
V/ns
Operating Junction Temperature
Storage Temperature
-55 to 150
°C
IPAK
5
100
--
275
TO-92
--
120
40
260
SOT-223
--
37.87(#)
--
260
Rthj-case
Rthj-amb
Rthj-lead
T
l
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Junction-lead Max
°C/W
°C/W
°C/W
°C
Maximum Lead Temperature For Soldering Purpose
Parameter
Max Value
0.8
Unit
A
60
mJ
Parameter
Test Conditions
Igs=± 1mA (Open Drain)
Min.
30
Typ.
Max.
Unit
V
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