參數(shù)資料
型號(hào)： ST7PLU09MAE
廠商： STMICROELECTRONICS
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PDSO8
封裝： 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
文件頁數(shù)： 16/124頁
文件大小： 1995K
代理商： ST7PLU09MAE
Package characteristics
ST7LUS5, ST7LU05, ST7LU09
112/124
13
Package characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
13.1
Package mechanical data
Figure 60.
8-pin plastic small outline package, 150-mil width
D
B
A1
A
h x 45°
A2
H
E
e
L
C
α
Dim.
mm
inches(1)
1.
Values in inches are converted from mm
and rounded to 3 decimal digits.
Min
Typ
Max
Min
Typ
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.158
e
1.27
0.050
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
α
0d
8d
L
0.40
1.27
0.016
0.050
Number of pins
N
8
Table 85.
Thermal characteristics
Symbol
Ratings
Package
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
SO8
130
°C/W
TJmax
Maximum junction temperature(1)
150
°C
PDmax
Power dissipation(2)
180
mW
1.
The maximum chip-junction temperature is based on technology characteristics.
2.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the
chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application.
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