參數(shù)資料
型號： SSTUP32866EC/S
廠商： NXP SEMICONDUCTORS
元件分類： 鎖存器
英文描述： 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96
封裝： 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96
文件頁數(shù)： 19/31頁
文件大小： 538K
代理商： SSTUP32866EC/S
SSTUP32866_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 14 September 2006
26 of 31
Philips Semiconductors
SSTUP32866
1.8 V DDR2-667/800 programmable registered buffer with parity
13. Soldering
13.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
13.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reow temperatures range from 215
°Cto260 °C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 14.
SnPb eutectic process - package peak reow temperatures (from
J-STD-020C
July 2004)
Package thickness
Volume mm3 < 350
Volume mm3
≥ 350
< 2.5 mm
240
°C+0/5 °C
225
°C+0/5 °C
≥ 2.5 mm
225
°C+0/5 °C
225
°C+0/5 °C
Table 15.
Pb-free process - package peak reow temperatures (from
J-STD-020C July
2004)
Package thickness
Volume mm3 < 350
Volume mm3 350 to
2000
Volume mm3 > 2000
< 1.6 mm
260
°C + 0 °C
260
°C + 0 °C
260
°C + 0 °C
1.6 mm to 2.5 mm
260
°C + 0 °C
250
°C + 0 °C
245
°C + 0 °C
≥ 2.5 mm
250
°C + 0 °C
245
°C + 0 °C
245
°C + 0 °C
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