參數(shù)資料
型號： SPC5668GF0AVMG
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 116 MHz, MICROCONTROLLER, PBGA208
封裝： 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208
文件頁數(shù)： 20/66頁
文件大小： 593K
代理商： SPC5668GF0AVMG
Electrical Characteristics
MPC5668x Microcontroller Data Sheet, Rev. 5
Freescale Semiconductor
27
4.2
Thermal Characteristics
4.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
TJ =TA +(RJA PD)
Eqn. 1
where:
6 AC signal over and undershoot of the input voltages of up to ±2.0 V is permitted for a cumulative duration of 60 hours over the
complete lifetime of the device (injection current does not need to be limited for this duration).
7 Internal structures will hold the input voltage above –1.0 V if the injection current limit of 2 mA is met.
8 Internal structures hold the input voltage below this maximum voltage on all pads powered by V
DDE supplies, if the maximum
injection current specification is met (25 mA for all pins) and VDDE is within Operating Voltage specifications.
9 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
10 Total injection current for all analog input pins must not exceed 15 mA.
11 Solder profile per CDF-AEC-Q100.
12 Moisture sensitivity per JEDEC test method A112.
Table 5. Thermal Characteristics
Spec
Characteristic
Symbol
Unit
Value
208 MAPBGA
256 MAPBGA
1
Junction to Ambient1, 2
Natural Convection
(Single layer board)
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
RJA
°C/W
39
2
Junction to Ambient1, 3
Natural Convection
(Four layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
°C/W
24
3
Junction to Ambient1, 3
(@200 ft./min., Single layer board)
RJMA
°C/W
31
4
Junction to Ambient1, 3
(@200 ft./min., Four layer board 2s2p)
RJMA
°C/W
20
5
Junction to Board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
°C/W
13
6
Junction to Case5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
°C/W
6
7
Junction to Package Top6
Natural Convection
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
°C/W
2
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相關代理商/技術參數(shù)
參數(shù)描述
SPC5668GF0AVMGR 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet
SPC5668GF0AVMJ 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet
SPC5668GF0AVMJR 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet
SPC5668GF1AMMG 功能描述:32位微控制器 - MCU 32B,2M NVM, GATEWAY RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風格:SMD/SMT
SPC5668GF1AMMGR 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet
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