參數(shù)資料
型號: SN74LVC3G14YZAR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8
封裝: GREEN, MO-211EB, DSBGA-8
文件頁數(shù): 9/15頁
文件大?。?/td> 385K
代理商: SN74LVC3G14YZAR
www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
1A
1Y
1
7
2A
2Y
3
5
3A
3Y
6
2
Absolute Maximum Ratings
(1)
TRIPLE SCHMITT-TRIGGER INVERTER
SCES367H – AUGUST 2001 – REVISED SEPTEMBER 2006
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(EACH INVERTER)
INPUT
OUTPUT
A
Y
H
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range(2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state(2)(3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI <0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCC or GND
±100
mA
DCT package
220
DCU package
227
θ
JA
Package thermal impedance(4)
°C/W
YEA/YZA package
140
YEP/YZP package
102
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The value of VCC is provided in the recommended operating conditions table.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
3
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