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參數(shù)資料
| 型號： | SMJ320C40TABM40/10 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 32-BIT, 40 MHz, OTHER DSP, UUC325 |
| 封裝： | TAB-325 |
| 文件頁數(shù)： | 57/64頁 |
| 文件大小： | 1155K |
| 代理商： | SMJ320C40TABM40/10 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9466902QXA
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
5962-9466902QXC
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
5962-9466902QYC
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
5962-9466903QXA
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
5962-9466903QXC
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
5962-9466903QYC
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
5962-9466904QXA
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
5962-9466904QYC
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SM320C40GFM40
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SM320C40GFM50
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SM320C40GFS60
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SM320C40HFHM40
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SM320C40HFHM50
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SM320C40HFHS60
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SM320C40KGDS50D
ACTIVE
XCEPT
KGD
0
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40GFM40
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40GFM50
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40GFS60
ACTIVE
CPGA
GF
325
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40HFHM40
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40HFHM50
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
SMJ320C40HFHS60
ACTIVE
CFP
HFH
352
1
TBD
Call TI
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SM320C40TABS60/10 | 32-BIT, 60 MHz, OTHER DSP, UUC325 |
| SMJ320C6201BGLPW20 | 32-BIT, 200 MHz, OTHER DSP, CBGA429 |
| SM320C6201BGLPW20 | 32-BIT, 200 MHz, OTHER DSP, CBGA429 |
| SMJ320C6414DGADW60 | 64-BIT, 75 MHz, OTHER DSP, CPGA570 |
| SM320C6414DGADW60 | 64-BIT, 75 MHz, OTHER DSP, CPGA570 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SMJ320C40TABM50 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Digital Signal Processor |
| SMJ320C40TABM50/10 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS |
| SMJ320C40TABS60 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Digital Signal Processor |
| SMJ320C40TABS60/10 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS |
| SMJ320C40TBBM40 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Digital Signal Processor |
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