
SM320C6701EP, SM320C6701MECHEP
FLOATINGPOINT DIGITAL SIGNAL PROCESSOR
SGUS042A MAY 1998 REVISED APRIL 2004
1
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
D Controlled Baseline
One Assembly/Test Site, One Fabrication
Site
D Extended Temperature Performance up to
40
°C to 105°C
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree
D Highest Performance Floating-Point Digital
Signal Processor (DSP) 320C6701
8.3-, 6-ns Instruction Cycle Time
120-, 167-MHz Clock Rate
Eight 32-Bit Instructions/Cycle
1 GFLOPS
320C6201 Fixed-Point DSP
Pin-Compatible
D VelociTI Advanced Very Long Instruction
Word (VLIW) C67x CPU Core
Eight Highly Independent Functional
Units:
Four ALUs (Floating- and Fixed-Point)
Two ALUs (Fixed-Point)
Two Multipliers (Floating- and
Fixed-Point)
Load-Store Architecture With 32 32-Bit
General-Purpose Registers
Instruction Packing Reduces Code Size
All Instructions Conditional
D Instruction Set Features
Hardware Support for IEEE
Single-Precision Instructions
Hardware Support for IEEE
Double-Precision Instructions
Byte-Addressable (8-, 16-, 32-Bit Data)
8-Bit Overflow Protection
Saturation
Bit-Field Extract, Set, Clear
Bit-Counting
Normalization
D 1M-Bit On-Chip SRAM
512K-Bit Internal Program/Cache
(16K 32-Bit Instructions)
512K-Bit Dual-Access Internal Data
(64K Bytes)
D 32-Bit External Memory Interface (EMIF)
Glueless Interface to Synchronous
Memories: SDRAM and SBSRAM
Glueless Interface to Asynchronous
Memories: SRAM and EPROM
52M-Byte Addressable External Memory
Space
D Four-Channel Bootloading
Direct-Memory-Access (DMA) Controller
With an Auxiliary Channel
D 16-Bit Host-Port Interface (HPI)
Access to Entire Memory Map
D Two Multichannel Buffered Serial Ports
(McBSPs)
Direct Interface to T1/E1, MVIP, SCSA
Framers
ST-Bus-Switching Compatible
Up to 256 Channels Each
AC97-Compatible
Serial-Peripheral-Interface (SPI)
Compatible (Motorola
)
D Two 32-Bit General-Purpose Timers
D Flexible Phase-Locked-Loop (PLL) Clock
Generator
D IEEE-1149.1 (JTAG)
Boundary-Scan-Compatible
D 352-Pin Ball Grid Array (BGA) Package
(GJC Suffix)
D 352-Pin Ball Grid Array (BGA) Mechanical
Shock-Tolerant Package (Mech~Shock)
Option (GJC Suffix)
D 0.18-m/5-Level Metal Process
CMOS Technology
D 3.3-V I/Os, 1.8-V Internal (120-MHz)
D 3.3-V I/Os, 1.9-V Internal (167-MHz)
Copyright
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VelociTI is a trademark of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range.
This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this
component beyond specified performance and environmental limits.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.