- 您現(xiàn)在的位置：買賣IC網(wǎng) > Datasheet目錄46 > SE95D,112 (NXP Semiconductors)IC SENSOR TEMP 2.8-5.5V SOT96-1 Datasheet資料下載
參數(shù)資料
| 型號(hào)： | SE95D,112 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 22/27頁(yè) |
| 文件大小： | 150K |
| 描述： | IC SENSOR TEMP 2.8-5.5V SOT96-1 |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 功能： | 溫度監(jiān)視系統(tǒng)（傳感器），監(jiān)視器 |
| 傳感器類型： | 內(nèi)部 |
| 感應(yīng)溫度： | -55°C ~ 125°C |
| 精確度： | ±3°C（最小值） |
| 拓?fù)洌?/td> | ADC（三角積分型），比較器，振蕩器，寄存器庫(kù) |
| 輸出類型： | 2 線串行，I²C? |
| 輸出警報(bào)： | 無(wú) |
| 輸出風(fēng)扇： | 是 |
| 電源電壓： | 2.8 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 管件 |
| 其它名稱： | 935274141112 SE95D SE95D-ND |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)當(dāng)前第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)
SE95_7
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 2 September 2009
22 of 27
NXP Semiconductors
SE95
Ultra high accuracy digital temperature sensor and thermal watchdog
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 Surface mount reow
soldering description .
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
" Through-hole components
" Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
" Board specications, including the board nish, solder masks and vias
" Package footprints, including solder thieves and orientation
" The moisture sensitivity level of the packages
" Package placement
" Inspection and repair
" Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
" Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
" Solder bath specications, including temperature and impurities
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SE97BTP,547 | IC TEMP SENSOR DIMM 8HWSON |
| SE98ATP,547 | IC TEMP SENSOR DDR 8-HWSON |
| SG6901ASZ | IC PFC CTLR AVERAGE CURR 20SOIC |
| SG6932SZ | IC PFC CONTROLLER CCM 16SOP |
| SG6961SY | IC PFC CTRLR AVERAGE CURR 8SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SE95D118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| SE95DP | 制造商:NXP Semiconductors 功能描述:IC TEMP SENSOR DIGITAL 8TSSOP 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, DIGITAL, 8TSSOP 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, DIGITAL, 8TSSOP; IC Output Type:Digital; Sensing Accuracy Range: 2C; Sensing Temperature Min:-55C; Sensing Temperature Max:+125C; Supply Voltage Min:2.8V; Supply Voltage Max:5.5V; Sensor Case Style:TSSOP; No. of ;RoHS Compliant: Yes |
| SE95DP,118 | 功能描述:板上安裝溫度傳感器 TEMP SENSOR DIGITAL RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| SE95DP,118-CUT TAPE | 制造商:NXP 功能描述:SE95D Series 2.8 V to 5.5 V 1% Accuracy Digital Temperature Sensor - TSSOP-8 |
| SE95DP118 | 制造商:NXP Semiconductors 功能描述:DIGITAL TEMP SENSOR IC 11BIT +/-3C TS |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。