參數(shù)資料
型號(hào)： SDM-USB-QS-S_
廠商： Linx Technologies Inc
文件頁(yè)數(shù)： 4/24頁(yè)
文件大?。?/td> 0K
描述： MODULE USB LOW SPEED
產(chǎn)品目錄繪圖： SDM-USB-QS-S Top
SDM-USB-QS-S Side
標(biāo)準(zhǔn)包裝： 25
系列： QS
應(yīng)用： USB，外設(shè)
接口： 并行/串行
電源電壓： 4.35 V ~ 5.25 V
封裝/外殼： 16-SMD 模塊
供應(yīng)商設(shè)備封裝： 模塊
包裝： 管件
安裝類型： 表面貼裝
其它名稱： SDM-USB-QS-S
SDM-USB-QS-S_-ND
SDM-USB-QS1-S
–
8
Shock During Reflow Transport
Since some internal module components may reflow along with the
components placed on the board being assembled, it is imperative that
the modules not be subjected to shock or vibration during the time solder
is liquid. Should a shock be applied, some internal components could be
lifted from their pads, causing the module to not function properly.
Washability
The modules are wash-resistant, but are not hermetically sealed.
Linx recommends wash-free manufacturing; however, the modules can
be subjected to a wash cycle provided that a drying time is allowed prior
to applying electrical power to the modules. The drying time should be
sufficient to allow any moisture that may have migrated into the module
to evaporate, thus eliminating the potential for shorting damage during
power-up or testing. If the wash contains contaminants, the performance
may be adversely affected, even after drying.
Module Description
The Linx SDM-USB-QS-S module will convert USB signals from a
host, such as a PC or hub, into TTL logic level signals. This enables the
module to be connected directly to microcontrollers (or Linx RF modules
for wireless applications) or to RS-232 or RS-485 level converters for
communication with legacy devices. The module handles all of the
complicated enumeration and bus communication processes, freeing the
designer to focus on handling the data. All necessary firmware is included
in the module and the device descriptors can easily be changed to
customize the device.
The host application software can access the USB device by simple,
custom functions or by standard Windows Win32 API calls. In addition,
Virtual COM Port drivers are available that make the USB module appear to
the PC as an additional COM port, without the need for additional system
resources, such as an IRQ or address. This allows the designer to program
the application software to use standard serial or parallel ports and then
simply select the port that represents the USB module. The drivers will
automatically direct the data to the USB bus and the device.
相關(guān)PDF資料
PDF描述
SI2457-D-GT IC ISOMODEM GLOBAL DAA 24TSSOP
SI3016-BS IC LINE-SIDE DAA 16SOIC
SI3452D-B01-GM IC POE CONTROLLER MIDSPAN 40QFN
SI4126-F-BMR IC SYNTHESIZER RF2/IF 28MLP
SI5040-A-GM IC TXRX XFP 10GBPS 32LGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SDM-USB-QS-S_ 功能描述:MODULE USB LOW SPEED RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:QS 特色產(chǎn)品:NXP - I2C Interface 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:2 通道 I²C 多路復(fù)用器 接口:I²C，SM 總線 電源電壓:2.3 V ~ 5.5 V 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:剪切帶 (CT) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:825 (CN2011-ZH PDF) 其它名稱:568-1854-1
SDMX-10TR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch
SDMX-10-X 功能描述:DIP 開(kāi)關(guān)/ SIP 開(kāi)關(guān) 10Pos SMT DIP RoHS:否 制造商:Omron Electronics 位置數(shù)量:10 開(kāi)關(guān)類型:DIP 執(zhí)行器:Rotary 端子節(jié)距:2.54 mm 觸點(diǎn)形式: 端接類型:Solder Pin 電流額定值:100 mA 電壓額定值 DC: 工作溫度范圍: 安裝:Through Hole
SDMX-10XR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch
SDMX-12TR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*