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參數(shù)資料
| 型號： | SDM-USB-QS-S_ |
| 廠商： | Linx Technologies Inc |
| 文件頁數(shù)： | 3/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | MODULE USB LOW SPEED |
| 產(chǎn)品目錄繪圖： | SDM-USB-QS-S Top SDM-USB-QS-S Side |
| 標準包裝： | 25 |
| 系列： | QS |
| 應用： | USB，外設 |
| 接口： | 并行/串行 |
| 電源電壓： | 4.35 V ~ 5.25 V |
| 封裝/外殼： | 16-SMD 模塊 |
| 供應商設備封裝： | 模塊 |
| 包裝： | 管件 |
| 安裝類型： | 表面貼裝 |
| 其它名稱： | SDM-USB-QS-S SDM-USB-QS-S_-ND SDM-USB-QS1-S |
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7
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the
reflow stage. The reflow profile in Figure 10 should not be exceeded
because excessive temperatures or transport times during reflow will
irreparably damage the modules. Assembly personnel will need to pay
careful attention to the oven’s profile to ensure that it meets the
requirements necessary to successfully reflow all components while still
remaining within the limits mandated by the modules. The figure below
shows the recommended reflow oven profile for the modules.
125°C
185°C
217°C
255°C
235°C
60
120
30
150180
210240
270300
330360
090
50
100
150
200
250
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
180°C
Temperature
(o
C)
Time (Seconds)
Figure 10: Maximum Reflow Profile
Automated Assembly
For high-volume assembly, most users will want to auto-place the modules.
The modules have been designed to maintain compatibility with reflow
processing techniques; however, due to their hybrid nature, certain aspects
of the assembly process are far more critical than for other component
types. Following are brief discussions of the three primary areas where
caution must be observed.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SDM-USB-QS-S_ | 功能描述:MODULE USB LOW SPEED RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:QS 特色產(chǎn)品:NXP - I2C Interface 標準包裝:1 系列:- 應用:2 通道 I²C 多路復用器 接口:I²C，SM 總線 電源電壓:2.3 V ~ 5.5 V 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:16-TSSOP 包裝:剪切帶 (CT) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:825 (CN2011-ZH PDF) 其它名稱:568-1854-1 |
| SDMX-10TR | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch |
| SDMX-10-X | 功能描述:DIP 開關(guān)/ SIP 開關(guān) 10Pos SMT DIP RoHS:否 制造商:Omron Electronics 位置數(shù)量:10 開關(guān)類型:DIP 執(zhí)行器:Rotary 端子節(jié)距:2.54 mm 觸點形式: 端接類型:Solder Pin 電流額定值:100 mA 電壓額定值 DC: 工作溫度范圍: 安裝:Through Hole |
| SDMX-10XR | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch |
| SDMX-12TR | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch |
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