參數(shù)資料
型號(hào)： SC68C752B
廠商： NXP Semiconductors N.V.
英文描述： 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs and Motorola mP interface
中文描述： 5伏，3.3伏和2.5伏兆5雙UART /秒（最大），64字節(jié)的FIFO和摩托羅拉手機(jī)接口
文件頁(yè)數(shù)： 44/46頁(yè)
文件大小： 219K
代理商： SC68C752B
9397 750 14963
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 28 April 2005
44 of 46
Philips Semiconductors
SC68C752B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 29:
Acronym
CPU
DMA
FIFO
LSB
MSB
UART
Abbreviations
Description
Central Processing Unit
Direct Memory Access
First In/First Out
Least Significant Bit
Most Significant Bit
Universal Asynchronous Receiver and Transmitter
Table 30:
Document ID
SC68C752B_2
Modifications:
Revision history
Release date
20050428
Added ‘a(chǎn)nd Motorola
μ
P interface’ to descriptive title on first page.
Section 2 “Features” on page 1
–
first bullet: added ‘with Motorola
μ
P interface
–
second bullet re-written
Added
Section 19 “Trademarks” on page 45
.
20050329
Product data sheet
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 14963
Supersedes
SC68C752B_1
SC68C752B_1
-
9397 750 13857
-
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC68C752BIB48 功能描述:UART 接口集成電路 2.5V-5V 2CH UART 64B FIFO MOT RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC68C752BIB48,128 功能描述:UART 接口集成電路 2.5V-5V 2CH UART 64B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC68C752BIB48,151 功能描述:UART 接口集成電路 UART DUAL W/FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC68C752BIB48,157 功能描述:UART 接口集成電路 2.5V-5V 2CH UART 64B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC68C752BIB48-F 功能描述:UART 接口集成電路 2.5V-5V 2CH UART 64B FIFO MOT RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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