參數(shù)資料
型號: SC16C752
廠商: NXP Semiconductors N.V.
英文描述: Dual UART with 64-byte FIFO
中文描述: 雙UART具有64字節(jié)FIFO
文件頁數(shù): 45/47頁
文件大?。?/td> 604K
代理商: SC16C752
Philips Semiconductors
SC16C752
Dual UART with 64-byte FIFO
Product data
Rev. 04 — 20 June 2003
45 of 47
9397 750 11635
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[4]
[5]
[6]
[7]
14. Revision history
Table 28:
Rev Date
04
Revision history
CPCN
20030620
Description
Product data (9397 750 11635); ECN 853-2379 30031 of 16 June 2003.
Modifications:
Figure 12 “Crystal oscillator connections.” on page 18
: capacitors’ values changed and
added connection with resistor.
Product data (9397 750 11196); ECN 853-2379 29623 of 10 March 2003.
Product data (9397 750 10811); ECN 853-2379 29261 of 06 December 2002.
Product data (9397 750 09575); ECN 853-2379 28891 of 10 September 2002.
-
03
02
01
20030313
20021216
20020910
-
-
-
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