參數(shù)資料
型號(hào)： SAK-XE169FH-136F100L
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP176
封裝： 0.50 MM PITCH, GREEN, PLASTIC, LQFP-176
文件頁數(shù)： 53/150頁
文件大?。?/td> 1805K
代理商： SAK-XE169FH-136F100L
XE169FH
XC2000 Family Derivatives / High Line
Package and Reliability
Data Sheet
146
V1.2, 2010-09
5
Package and Reliability
The XE166 Family devices use the package type PG-LQFP (Plastic Green - Low Profile
Quad Flat Package). The following specifications must be regarded to ensure proper
integration of the XE169xH in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XE169xH is a member of the XE166 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 42
Package Parameters (PG-LQFP-176-12)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
7.9
× 7.9
mm
–
Power Dissipation
P
DISS
–
< 1
W–
Thermal resistance
Junction-Ambient
RΘJA
–
42
K/W No thermal via
1)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
34
K/W 4-layer, no pad
2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
22
K/W 4-layer, pad
3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
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SAK-XE169FH-136F100L AA 功能描述:16位微控制器 - MCU 16-Bit Single-Chip RealTime Signal Ctrl RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAK-XE169FH-136F100L AB 功能描述:16位微控制器 - MCU 16-Bit Single-Chip RealTime Signal Ctrl RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAK-XE169FH-200F100L AA 功能描述:16位微控制器 - MCU 16-Bit Single-Chip RealTime Signal Ctrl RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAK-XE169FH-200F100L AB 功能描述:16位微控制器 - MCU 16-Bit Single-Chip RealTime Signal Ctrl RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAL 制造商:SHARMA 制造商全稱:Sharma Electro Components,Inc 功能描述:Tantalum Capacitors
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