參數(shù)資料
型號： SAK-XC2785X-72F80L
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP144
封裝： 0.50 MM PITCH, GREEN, PLASTIC, LQFP-144
文件頁數(shù)： 43/141頁
文件大?。?/td> 1793K
代理商： SAK-XC2785X-72F80L
XC2785X
XC2000 Family / Base Line
Package and Reliability
Data Sheet
137
V2.1, 2011-07
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC2785X in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC2785X is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 42
Package Parameters (PG-LQFP-144-13)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
6.5
× 6.5
mm
–
Power Dissipation
P
DISS
–1.0
W
–
Thermal resistance
Junction-Ambient
RΘJA
–
43
K/W No thermal via
1)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
34
K/W 4-layer, no pad
2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
21
K/W 4-layer, pad
3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
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