- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄225145 > SA58672TK (NXP Semiconductors N.V.) 3.0 W mono class-D audio amplifier PDF資料下載
參數(shù)資料
| 型號： | SA58672TK |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 3.0 W mono class-D audio amplifier |
| 封裝： | SA58672TK<SOT650-2 (HVSON10)|<<http://www.nxp.com/packages/SOT650-2.html<1<Always Pb-free,;SA58672UK<Uncased die|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 8/27頁 |
| 文件大?。?/td> | 183K |
| 代理商： | SA58672TK |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁當前第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁
SA58672_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 8 June 2009
16 of 27
NXP Semiconductors
SA58672
3.0 W mono class-D audio amplier
For applications in which there are circuits that are EMI sensitive to low frequency
(< 1 MHz) and there are long leads from amplier to speaker, it may be necessary to use
an LC output lter.
11.7 Efciency and thermal considerations
The maximum ambient operating temperature depends on the heat transferring ability of
the heat spreader on the PCB layout. In Table 3 “Limiting values”, power dissipation, the
power derating factor is given as 10 mW/K. The device thermal resistance, Rth(j-a) is the
reciprocal of the power derating factor. Convert the power derating factor to Rth(j-a) by
(4)
For a maximum allowable junction temperature, Tj = 150 °C and Rth(j-a) = 100 K/W and a
maximum device dissipation of 0.84 W (420 mW per channel) and for 1.7 W per channel
output power, 4
load, 5 V supply, the maximum ambient temperature is calculated using
(5)
The maximum ambient temperature is 66
°C at maximum power dissipation for 5 V supply
and 4
load. If the junction temperature of the SA58672 rises above 150 °C, the thermal
protection circuitry turns the device off; this prevents damage to the IC. Using speakers
greater than 4
further enhances thermal performance and battery lifetime by reducing
the output load current and increasing amplier efciency.
11.8 Additional thermal information
The SA58672 9 bump WLCSP package ground bumps are soldered directly to the PCB
heat spreader. By the use of thermal vias, the bumps may be soldered directly to a ground
plane or special heat sinking layer designed into the PCB. The thickness and area of the
heat spreader may be maximized to optimize heat transfer and achieve lower package
thermal resistance.
The SA58672 HVSON10 package has an exposed Die Attach Paddle (DAP), which is
soldered directly to the PCB heat spreader to provide enhanced heat transfer and achieve
lowest package thermal resistance.
R
th j-a
()
1
derating factor
------------------------------------------
1
0.01
----------
100 K /W
==
=
T
amb max
()
T
j max
()
R
th j-a
()
P
max
×
()
–
150
100
0.84
×
()
–
66
°C
==
=
相關PDF資料 |
PDF描述 |
|---|---|
| SA58672UK | 3.0 W mono class-D audio amplifier |
| SAA-50T-3 | 2 mm2, BRASS, TIN FINISH, FORK TERMINAL |
| SAA5667HL/NNNN | 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP100 |
| SAA7169 | 9-BIT DAC, PQCC44 |
| SAA7367TD-T | 1-CH 18-BIT DELTA-SIGMA ADC, SERIAL ACCESS, PDSO24 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SA58672TK,138 | 功能描述:音頻放大器 Audio Amp SPKR 1-CH Mono 3W ClassD 10Pin RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672TK138 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 3W SON-10 |
| SA58672UK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.0 W mono class-D audio amplifier |
| SA58672UK,027 | 功能描述:音頻放大器 3.W MONO CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672UK-G | 功能描述:音頻放大器 3.W MONO CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復。