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| 型號： | SA58672TK |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 3.0 W mono class-D audio amplifier |
| 封裝： | SA58672TK<SOT650-2 (HVSON10)|<<http://www.nxp.com/packages/SOT650-2.html<1<Always Pb-free,;SA58672UK<Uncased die|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 15/27頁 |
| 文件大小： | 183K |
| 代理商： | SA58672TK |
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SA58672_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 8 June 2009
22 of 27
NXP Semiconductors
SA58672
3.0 W mono class-D audio amplier
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reow soldering itself
15.3 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 19) than a PbSn process, thus
reducing the process window
MSL: Moisture Sensitivity Level
Fig 18. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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PDF描述 |
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| SA58672UK | 3.0 W mono class-D audio amplifier |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58672TK,138 | 功能描述:音頻放大器 Audio Amp SPKR 1-CH Mono 3W ClassD 10Pin RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672TK138 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 3W SON-10 |
| SA58672UK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.0 W mono class-D audio amplifier |
| SA58672UK,027 | 功能描述:音頻放大器 3.W MONO CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672UK-G | 功能描述:音頻放大器 3.W MONO CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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