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| 型號： | SA58672TK |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 3.0 W mono class-D audio amplifier |
| 封裝： | SA58672TK<SOT650-2 (HVSON10)|<<http://www.nxp.com/packages/SOT650-2.html<1<Always Pb-free,;SA58672UK<Uncased die|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 17/27頁 |
| 文件大?。?/td> | 183K |
| 代理商： | SA58672TK |
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SA58672_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 8 June 2009
24 of 27
NXP Semiconductors
SA58672
3.0 W mono class-D audio amplier
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefcient) differences between substrate and chip.
15.3.2 Quality of solder joint
A ip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reow can occur during the reow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
15.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and ux residues
and/or underll removed. When a new chip is placed on the substrate, use the ux
process instead of solder on the solder lands. Apply ux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reow the solder, use the solder prole shown in application note
AN10365 “Surface mount reow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reow soldering.
16. Abbreviations
Table 9.
Abbreviations
Acronym
Description
APA
Audio Precision Analyzer
CODEC
compressor-decompressor
DAP
Die Attach Paddle
DUT
Device Under Test
DVD
Digital Video Disc
EMI
ElectroMagnetic Interference
ESR
Equivalent Series Resistance
FCC
Federal Communications Commission
FFT
Fast Fourier Transform
IC
Integrated Circuit
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PDF描述 |
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| SA58672UK | 3.0 W mono class-D audio amplifier |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58672TK,138 | 功能描述:音頻放大器 Audio Amp SPKR 1-CH Mono 3W ClassD 10Pin RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672TK138 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 3W SON-10 |
| SA58672UK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.0 W mono class-D audio amplifier |
| SA58672UK,027 | 功能描述:音頻放大器 3.W MONO CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672UK-G | 功能描述:音頻放大器 3.W MONO CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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