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參數(shù)資料
| 型號(hào)： | SA58631 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 3 W BTL audio amplifier |
| 中文描述： | 3瓦橋接音頻放大器 |
| 文件頁(yè)數(shù)： | 17/19頁(yè) |
| 文件大?。?/td> | 175K |
| 代理商： | SA58631 |
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SA58631
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 1 December 2005
17 of 19
Philips Semiconductors
SA58631
3 W BTL audio amplifier
Printed-Circuit Board
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
17. Abbreviations
18. Revision history
Table 9:
Acronym
Abbreviations
Description
BTL
Bridge Tied Load
CMOS
Complementary Metal Oxide Silicon
DAP
Die Attach Paddle
ESD
ElectroStatic Discharge
NPN
Negative-Positive-Negative
PCB
PNP
Positive-Negative-Positive
RMS
Root Mean Squared
THD
Total Harmonic Distortion
Table 10:
Document ID
Revision history
Release date
Data sheet status
Change notice
Doc. number
Supersedes
SA58631_1
20051201
Preliminary data sheet
-
SA58631_1
-
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| SA58632 | 2 x 2.2 W BTL audio amplifier |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58631TK | 制造商:NXP Semiconductors 功能描述:AMP AUDIO 3W MONO AB 8HVSON 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 3W, MONO, AB, 8HVSON |
| SA58631TK,115 | 功能描述:音頻放大器 3W BTL AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58631TK,118 | 功能描述:音頻放大器 3W BTL AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58631TK,157 | 功能描述:音頻放大器 3W BTL AUDIO AMPLIFIER RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58631TK115 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 3W SON-8 |
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