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參數(shù)資料
| 型號： | S29AL016D70TFI013 |
| 廠商： | SPANSION LLC |
| 元件分類： | DRAM |
| 英文描述： | 16 MEGABIT CMOS 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY |
| 中文描述： | 1M X 16 FLASH 3V PROM, 70 ns, PDSO48 |
| 封裝： | LEAD FREE, MO-142DDD, TSOP-48 |
| 文件頁數(shù)： | 56/58頁 |
| 文件大?。?/td> | 1037K |
| 代理商： | S29AL016D70TFI013 |
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56
S29AL016D
S29AL016D_00_A2 December 17, 2004
P r e l i m i n a r y
Physical Dimensions
VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
8.15 mm x 6.15 mm
3338 \ 16-038.25b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
SIDE VIEW
TOP VIEW
SEATING PLANE
A2
A
(4X)
0.10
10
D
E
C
0.10
A1
C
B
A
C
0.08
BOTTOM VIEW
A1 CORNER
B
A
M
φ
0.15
C
M
7
7
6
e
SE
SD
6
5
4
3
2
A
B
C
D
E
F
G
1
H
φ
b
E1
D1
C
φ
0.08
PIN A1
CORNER
INDEX MARK
PACKAGE
VBK 048
JEDEC
N/A
8.15 mm x 6.15 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.00
OVERALL THICKNESS
A1
0.18
---
---
BALL HEIGHT
A2
0.62
---
0.76
BODY THICKNESS
D
8.15 BSC.
BODY SIZE
E
6.15 BSC.
BODY SIZE
D1
5.60 BSC.
BALL FOOTPRINT
E1
4.00 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N
φ
b
e
48
TOTAL BALL COUNT
0.35
---
0.43
BALL DIAMETER
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
---
DEPOPULATED SOLDER BALLS
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相關代理商/技術(shù)參數(shù) |
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|---|---|
| S29AL016D70TFI020 | 制造商:Spansion 功能描述:NOR Flash Parallel 3V/3.3V 16Mbit 2M/1M x 8bit/16bit 70ns 48-Pin TSOP Tray |
| S29AL016D70TFI020-ACT-PRO | 制造商:Spansion 功能描述: |
| S29AL016D70TFI020H | 制造商:Spansion 功能描述:Cut Tape |
| S29AL016D70TFI023 | 制造商:Spansion 功能描述: |
| S29AL016D70TFN020 | 制造商:Spansion 功能描述: |
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