參數(shù)資料
型號： RD38F1010C0ZTL0
廠商： INTEL CORP
元件分類： 存儲器
英文描述： 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA66
封裝： 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù)： 45/70頁
文件大?。?/td> 1223K
代理商： RD38F1010C0ZTL0
3VoltIntel
Advanced+BootBlockFlashMemoryStacked-CSPFamily
Datasheet
45
7.4.1
SRAMOperationduringFlash“Busy”
ThisfunctionalityprovidestheabilitytouseboththeflashandtheSRAM“atthesametime”
withinasystem,similartotheoperationoftwodeviceswithseparatefootprints.Thisoperationcan
beachievedbyfollowingtheappropriatetimingconstraintswithinasystem.
7.4.2
SimultaneousBusOperations
OperationsthatrequireboththeSRAMandFlashtobeinactivemodearedisallowed.Anexample
ofthesecaseswouldincludesimultaneousreadsonboththeflashandSRAM,whichwouldresult
incontentionforthedatabus.Finally,areadofonedevicewhileattemptingtowritetotheother
(similartotheconditionsofdirectmemoryaccess(DMA)operation)arealsonotwithinthe
recommendedoperatingconditions.Basically,onlyonememorycandrivetheoutputsoutthe
deviceatonegivenpointintime.
7.5
PrintedCircuitBoardNotes
TheIntelStacked-CSPwillsavesignificantspaceonyourPCBbycombiningtwochipsintoone
BGAstylepackage.IntelStacked-CSPhasa0.8mmpitchthatcanberoutedonyourPrinted
CircuitBoardwithconventionaldesignrules.Tracewidthsof0.127mm(0.005inches)aretypical.
Unusedballsinthecenterofthepackagearenotpopulatedtofurtherincreasetheroutingoptions.
StandardsurfacemountprocessandequipmentcanbeusedfortheIntelStacked-CSP.
NOTE:
TopView
7.6
SystemDesignNotesSummary
TheAdvanced+BootBlockStacked-CSPallowshigherlevelsofmemorycomponentintegration.
Differentpowersupplyconfigurationscanbeusedwithinthesystemtoachievedifferent
objectives.Atleastthreedifferent0.1μfcapacitorsshouldbeusedtodecouplethedeviceswithina
system.SRAMreadsorwritesduringaflashprogramorerasearesupportedoperations.Standard
printedcircuitboardtechnologycanbeused.
Figure14.StandardPCBDesignRulesCanbeUsedwithStacked-CSPDevice
LandPadDiameter:0.35mm(0.0138in)
SolderMaskOpening:0.50mm(0.0198in)
TraceWidth:0.127mm(0.005in)
TraceSpaces:0.160mm(0.00625in)
ViaCapturePad:0.51mm(0.020in)
ViaDrillSize:0.25mm(0.010in)
相關(guān)PDF資料
PDF描述
RD38F1020C0ZBL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F3208C3B70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F3204C3B70 TVS BIDIRECT 400W 18V SMA
RD28F1602C3B70 TVS 400W 20V UNIDIRECT SMA
RD28F1604C3B90 TVS UNI-DIR 9.0V 400W SMA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RD38F1010W0YBQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0YDQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0YTQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0ZBQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0ZDQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*