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PRODUCT SPECIFICATION
RC5054A
3
Absolute Maximum Ratings
Recommended Operating Conditions
Thermal Characteristics
Parameter
Thermal Resistance
SOIC Package
SOIC Package
Maximum Junction Temperature
Maximum Storage Temperature Range
Maximum Lead Temperature
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
17
LGATE
Connect LGATE to the lower MOSFET gate. This pin provides the gate drive for the
lower MOSFET.
Provide a 12V bias supply for the chip to this pin.
The OVP pin can be used to drive an external SCR in the event of an overvoltage
condition.
This pin provides oscillator switching frequency adjustment. By placing a resistor
(R
T
) from this pin to GND, the nominal 200KHz switching frequency is increased
according to the following equation:
18
19
VCC
OVP
20
RT
Conversely, connecting a pull-up resistor (RT) from this pin to VCC reduces the
switching frequency according to the following equation:
Min.
Max.
6V
+13.5V
+13.5V
+ 0.3V
Class 2
Power Input Voltage, V
Supply Voltage, V
Boot Voltage, V
V
CC
or I/O Voltage
ESD Classification
IN
CC
BOOT
- V
PHASE
GND -0.3V
V
CC
Min.
Max.
Supply Voltage, V
Ambient Temperature Range
Junction Temperature Range
CC
+12V -10%
0
°
0
°
+12V +10%
70
°
125
C
C
C
°
C
Conditions
Min.
Typ.
Max.
Units
1
θ
JA
With 3in
Plastic Package
2
of Copper
110
86
°
°
C/W
C/W
°
C
°
C
°
C
150
150
300
-65
Soldering 10s
Pin Definitions
(continued)
Pin Number Pin Names
Pin Function Description
F
S
200kHz
----------------R
6
T
Kohm
KHz x Kohm
[
[
]
]
+
=
R
T
to GND
(
)
F
S
200kHz
--------------R
5
T
Kohm
[
]
[
]
–
=
R
T
to 12V
(
)