
PRODUCT SPECIFICATION
RC4559
12
Mechanical Dimensions
(continued)
8-Lead SOIC Package
8
5
1
4
D
A
A1
– C –
LEAD COPLANARITY
ccc C
SEATING
PLANE
e
B
L
h x 45
C
a
E
H
A
A1
B
C
D
.053
.004
.013
.008
.189
.069
.010
.020
.010
.197
1.35
0.10
0.33
0.20
4.80
1.75
0.25
0.51
0.25
5.00
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
E
e
H
h
L
N
.150
.158
3.81
4.01
.228
.010
.016
.244
.020
.050
5.79
0.25
0.40
6.20
0.50
1.27
.050 BSC
1.27 BSC
0
—
8
0
—
8
3
6
5
2
2
8
8
a
ccc
.004
0.10
Notes:
1.
2.
"D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
"L" is the length of terminal for soldering to a substrate.
Terminal numbers are shown for reference only.
"C" dimension does not include solder finish thickness.
Symbol "N" is the maximum number of terminals.
3.
4.
5.
6.
Dimensioning and tolerancing per ANSI Y14.5M-1982.