參數(shù)資料
型號: PZTM1102
廠商: NXP SEMICONDUCTORS
元件分類: 功率晶體管
英文描述: Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:8; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
中文描述: 0.2 A, PNP, Si, POWER TRANSISTOR
封裝: PLASTIC PACKAGE-4
文件頁數(shù): 2/7頁
文件大小: 64K
代理商: PZTM1102
1996 May 09
2
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
FEATURES
Low output capacitance
Fast switching time
Integrated Schottky protection
diode.
APPLICATIONS
High-speed switching for industrial
applications.
DESCRIPTION
Combination of a PNP transistor and a Schottky barrier diode in a plastic
SOT223 package. NPN complement: PZTM1101.
PINNING
PIN
DESCRIPTION
1
2
3
4
cathode Schottky
base
emitter
collector, anode Schottky
Fig.1 Simplified outline (SOT223) and symbol.
Marking code:
TM1102.
handbook, halfpage
4
1
1
4
2
3
2
3
MAM237
Top view
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1.
2.
An additional copper area of >20 mm
2
is required for pin 1, if power dissipation in the Schottky die is >0.5 W.
It is not allowed to dissipate the total power of 1.2 W in the Schottky die only.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
PNP transistor
V
CBO
V
CES
V
EBO
I
C
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
open emitter
V
BE
= 0
open collector
40
40
6
200
V
V
V
mA
Schottky barrier diode
V
R
I
F
I
F(AV)
P
T
j
continuous reverse voltage
forward current (DC)
average forward current
power dissipation
junction temperature
40
1
1
0.5
125
150
V
A
A
W
°
C
°
C
up to T
amb
= 25
°
C; note 1
reverse current applied
forward current applied
Combined device
P
tot
T
amb
T
stg
T
j
total power dissipation
operating ambient temperature
storage temperature
junction temperature
up to T
amb
= 25
°
C; note 2
55
55
1.2
+150
+150
150
W
°
C
°
C
°
C
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