參數(shù)資料
型號: PID9q-604e
廠商: IBM Microeletronics
英文描述: 32-Bit RISC Microprocessor(32位精簡指令集微處理器)
中文描述: 32位RISC微處理器(32位精簡指令集微處理器)
文件頁數(shù): 19/29頁
文件大小: 543K
代理商: PID9Q-604E
9/17/99 Revision 1.4
PID9q-604e Hardware Datasheet
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
19
1.7 Package Description
The package parameters for the 604e are provided in the following list. The package type is 21 mm, 256-
lead ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Maximum module height
3.30 mm
Ball diameter
0.89 mm (35 mil)
WT
D02
Low
Output
VDD
F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06,
J08, J09, J11, K07, K10, L06, L08, L09, L11
VOLTDETGND
2
F03
XATS
J16
Low
I/O
Notes:
1. These are test signals for factory use only and must be pulled up to Vdd for normal machine operation.
2. NC (no-connect) in the 604; internally tied to GND in the 604e CBGA package to indicate to the power
supply that a low-voltage processor is present.
3. To operate in accordance with these specifications, the drive mode signals must be configured with
DRVMOD0 = high, and DRVMOD1 = high.
Table 10. Pinout Listing for the CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
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