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參數(shù)資料
| 型號： | PCF8578T |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | LCD驅動器 |
| 英文描述： | LCD row-column driver for dot matrix graphic displays |
| 封裝： | PCF8578HT/1<SOT357-1 (TQFP64)|<<http://www.nxp.com/packages/SOT357-1.html<1<Always Pb-free,;PCF8578T/1<SOT190-1 (VSO56)|<<http://www.nxp.com/packages/SOT190-1.html<1&l |
| 文件頁數(shù)： | 36/46頁 |
| 文件大?。?/td> | 274K |
| 代理商： | PCF8578T |
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PCF8578_6
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 5 May 2009
41 of 46
NXP Semiconductors
PCF8578
LCD row/column driver for dot matrix graphic displays
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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| PCI-36RS-SB-L | STRAIGHT TELECOM AND DATACOM CONNECTOR |
| PCI-36SS-SB-N | STRAIGHT TELECOM AND DATACOM CONNECTOR |
| PCI-36SS-B-H | STRAIGHT TELECOM AND DATACOM CONNECTOR |
| PCI-50R-B-LT | RIGHT ANGLE TELECOM AND DATACOM CONNECTOR |
| PCI-50S-B-UT | RIGHT ANGLE TELECOM AND DATACOM CONNECTOR |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8578T/1 | 制造商:NXP Semiconductors 功能描述:IC LCD DRIVER ROW/COLUMN 56VSOP 制造商:NXP Semiconductors 功能描述:IC, LCD DRIVER, ROW/COLUMN, 56VSOP |
| PCF8578T/1,112 | 功能描述:LCD 驅動器 LCD DRVR DOT MATRIX RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
| PCF8578T/1,118 | 功能描述:LCD 驅動器 DOT MATRIX LCD DRIVER (R/COLM) RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
| PCF8578T/1112 | 制造商:NXP Semiconductors 功能描述:IC LCD DRVR 6V VSOP-56 |
| PCF8578TD | 功能描述:LCD 驅動器 LCD DRVR DOT MATRIX RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
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