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參數(shù)資料
| 型號： | PCF8562 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal LCD driver for low multiplex rates |
| 中文描述： | 通用LCD驅(qū)動(dòng)器的低復(fù)用率 |
| 文件頁數(shù)： | 32/36頁 |
| 文件大小： | 928K |
| 代理商： | PCF8562 |
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November 22, 2004
32
Philips Semiconductors
Preliminary specification
Universal LCD driver
for low multiplex rates
PCF8562
14 SOLDERING
14.1
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain
surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by
legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder paste material. The top-surface
temperature of the packages should preferably be kept:
below 220
°
C (SnPb process) or below 245
°
C (Pb-free process)
– for all the BGA packages
– for packages with a thickness
≥
2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called thick/large packages.
below 235
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a thickness < 2.5 mm and a volume
< 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with
a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be parallel to the transport direction
of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the printed-circuit
board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or 265
°
C, depending on solder material
applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8562_09 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCF8562_11 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCF8562DTT/2,518 | 制造商:NXP Semiconductors 功能描述:Tape & Reel |
| PCF8562TT/2 | 制造商:NXP Semiconductors 功能描述: |
| PCF8562TT/2,118 | 功能描述:LCD 驅(qū)動(dòng)器 LCD DRIVER 32/128SEG RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時(shí)鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
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