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參數(shù)資料
| 型號(hào)： | PCF5079 |
| 廠(chǎng)商： | NXP Semiconductors N.V. |
| 英文描述： | Dual-band power amplifier controller for GSM, PCN and DCS |
| 中文描述： | 雙頻功率的GSM，PCN和DCS放大器控制器 |
| 文件頁(yè)數(shù)： | 26/28頁(yè) |
| 文件大?。?/td> | 146K |
| 代理商： | PCF5079 |
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2001 Nov 21
26
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
15.2.3
S
TENCIL DESIGN FOR PERIMETER PADS
For optimum paste release the area and aspect ratios of
the stencil should be greater than 0.66 and 1.5
respectively.
where:
L = aperture length
W = aperture width
T = stencil thickness.
15.2.4
S
TENCIL DESIGN FOR THERMAL PADS
In order to remove the heat effectively from the package
and to enhance electrical performance the die-attach
paddle needs to be soldered to the PCB thermal pad,
preferably with minimum voids.
It is therefore recommended that smaller, multiple
openings in a stencil should be used instead of one large
opening for printing solder paste in the thermal pad region.
Thisresultstypicallyin50%to80%solderpastecoverage.
Two examples are shown in Fig.21.
15.2.5
S
TENCIL THICKNESS
A stencil thickness of 0.125 to 0.150 mm is recommended
but this value needs to be optimized by the user to find the
proper thickness according to application requirements.
Area ratio
aperture wall area
area of aperture opening
W
×
2T(L + W)
----L
=
=
Aspect ratio
stencil thickness
T
=
=
handbook, full pagewidth
MGW499
Fig.21 Examples of thermal pad stencil design.
a. Outline of 0.4 mm
2
2
×
2 array giving
44% solder paste coverage.
b. Outline of 1.2 mm
2
2
×
1 array giving
60% solder paste coverage.
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相關(guān)代理商/技術(shù)參數(shù) |
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| PCF5079HK | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Dual-band power amplifier controller for GSM, PCN and DCS |
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| PCF5081 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:GSM baseband processors for digital mobile cellular radio |
| PCF5082 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:GSM baseband processors for digital mobile cellular radio |
| PCF5083 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:GSM signal processing IC |
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