- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382381 > PCF5079 (NXP Semiconductors N.V.) Dual-band power amplifier controller for GSM, PCN and DCS PDF資料下載
參數(shù)資料
| 型號： | PCF5079 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Dual-band power amplifier controller for GSM, PCN and DCS |
| 中文描述： | 雙頻功率的GSM，PCN和DCS放大器控制器 |
| 文件頁數(shù)： | 24/28頁 |
| 文件大?。?/td> | 146K |
| 代理商： | PCF5079 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁當前第24頁第25頁第26頁第27頁第28頁
2001 Nov 21
24
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
14.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| PCF5079HK | 3455RMG Series Phenolic Manual Reset Thermostats |
| PCF5079T | Dual-band power amplifier controller for GSM, PCN and DCS |
| PCF5081 | STEEL COVER |
| PCF5082 | GSM baseband processors for digital mobile cellular radio |
| PCF5083 | STEEL COVER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| PCF5079HK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual-band power amplifier controller for GSM, PCN and DCS |
| PCF5079T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual-band power amplifier controller for GSM, PCN and DCS |
| PCF5081 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM baseband processors for digital mobile cellular radio |
| PCF5082 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM baseband processors for digital mobile cellular radio |
| PCF5083 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM signal processing IC |
發(fā)布緊急采購，3分鐘左右您將得到回復。