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參數(shù)資料
| 型號(hào)： | PCD3359A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| 中文描述： | 8位的DTMF產(chǎn)生器和128字節(jié)EEPROM的微控制器 |
| 文件頁數(shù)： | 30/32頁 |
| 文件大?。?/td> | 165K |
| 代理商： | PCD3359A |
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1998 May 11
30
Philips Semiconductors
Product specification
8-bit microcontroller with DTMF
generator and 128 bytes EEPROM
PCD3359A
21 SOLDERING
21.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
21.2
DIP
21.2.1
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
21.2.2
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
21.3
LQFP and SO
21.3.1
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all LQFP and
SO packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
°
C.
21.3.2
W
AVE SOLDERING
21.3.2.1
LQFP
Wave soldering is
not
recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
21.3.2.2
SO
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
21.3.2.3
Method (LQFP and SO)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
CAUTION
Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCD3359AH | 8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3359AP | 8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3359AT | 8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3360 | Programmable multi-tone telephone ringer |
| PCD3360P | Programmable multi-tone telephone ringer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCD3359AH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3359AP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3359AT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with DTMF generator and 128 bytes EEPROM |
| PCD3360 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Programmable multi-tone telephone ringer |
| PCD3360P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Programmable multi-tone telephone ringer |
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