- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382379 > PCD3316 (NXP Semiconductors N.V.) Caller-ID on Call Waiting CIDCW receiver PDF資料下載
參數(shù)資料
| 型號： | PCD3316 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Caller-ID on Call Waiting CIDCW receiver |
| 中文描述： | 來電呼叫等待CIDCW編號接收機 |
| 文件頁數(shù)： | 26/30頁 |
| 文件大?。?/td> | 534K |
| 代理商： | PCD3316 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁當(dāng)前第26頁第27頁第28頁第29頁第30頁
Philips Semiconductors
PCD3316
CIDCW receiver
Product specification
11 March 1999
26 of 30
9397 750 04824
Philips Electronics N.V. 1999. All rights reserved.
Unetited
SSOP, TSSOP, VSO
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
13.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
Table 19: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
Wave
not suitable
not suitable
[2]
suitable
not recommended
[3] [4]
not recommended
[5]
Reflow
[1]
suitable
suitable
suitable
suitable
suitable
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC, SO, SOJ
LQFP, QFP, TQFP
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCD3316T | Caller-ID on Call Waiting CIDCW receiver |
| PCD3330-1 | Multistandard repertory dialler/ringer with EEPROM |
| PCD3330-1P | Multistandard repertory dialler/ringer with EEPROM |
| PCD3330-1T | Multistandard repertory dialler/ringer with EEPROM |
| PCD3354AH | 8-bit microcontrollers with DTMF generator and 256 bytes EEPROM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCD3316T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Caller-ID on Call Waiting CIDCW receiver |
| PCD3316TD-T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Caller Number ID Circuit |
| PCD3320CD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Pulse Telephone Dialer |
| PCD3321CD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Pulse Telephone Dialer |
| PCD3322CP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Pulse Telephone Dialer |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。