參數(shù)資料
型號(hào)： PCA8565
廠商： NXP Semiconductors N.V.
英文描述： Real time clock/calender
中文描述： 實(shí)時(shí)時(shí)鐘/ calender
文件頁(yè)數(shù)： 22/26頁(yè)
文件大?。?/td> 581K
代理商： PCA8565
Philips Semiconductors
PCA8565
Real time clock/calender
Product data
Rev. 01 — 31 March 2003
22 of 26
9397 750 10695
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferably be kept:
below 220
°
C for all the BGA packages and packages with a thickness
≥
2.5mm
and packages with a thickness <2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages
below 235
°
C for packages with a thickness <2.5 mm and a volume <350 mm
3
so
called small/thin packages.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
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PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA8565BS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real time clock/calendar
PCA8565BS/1,118 功能描述:實(shí)時(shí)時(shí)鐘 AUTOMOTIVE CLOCK/CAL RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
PCA8565BS/1-T 功能描述:實(shí)時(shí)時(shí)鐘 AUTOMOTIVE CLOCK/CAL RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
PCA8565TS 制造商:PHIL 功能描述:
PCA8565TS/1,118 功能描述:實(shí)時(shí)時(shí)鐘 CMOS RTC/CALENDAR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
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