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參數(shù)資料
| 型號： | PC107AVGHU100L |
| 廠商： | Atmel Corp. |
| 英文描述： | PCI Bridge Memory Controller |
| 中文描述： | PCI橋內(nèi)存控制器 |
| 文件頁數(shù)： | 17/50頁 |
| 文件大小： | 453K |
| 代理商： | PC107AVGHU100L |
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17
PC107A [Preliminary]
2137C–HIREL–03/04
Thermal Management
Information
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
= T
A
+ (R
θ
JA
×
P
D
)
where
T
A
= ambient temperature for the package (
°
C)
R
θ
JA
= junction-to-ambient thermal resistance (
°
C/W)
P
D
= power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a
quick and easy estimation of thermal performance. Table 4 has four junction-to-ambient
thermal resistances (R
θ
JA
or R
θ
JMA
). Two test boards are used: single-signal-layer (1s)
and four-layer boards with two internal planes (2s2p). Which value is closer to the appli-
cation depends on the system board thermal resistance and the density of other high-
power dissipation components.
To illustrate the process, determine the junction temperature based on the values pro-
vided in Table 4 for an PC107 that is mounted on a board with many internal planes
using arbitrary values. If the PC107 is doing most of the power dissipation, use R
θ
JMA
of
26
°
C/W given in Table 4. The ambient temperature near the device is 45
°
C. Suppose
the total typical power dissipation at 100 MHz core frequency is 2.1W (see Table 6). The
junction temperature is:
T
J
= 45 + (2.1
×
26) = 100
°
C.
If this value is less than the maximum junction temperature noted in Table 2, the PC107
will not need a heat sink. If the ambient temperature is higher or the power dissipation is
higher because of faster bus speed, the device will probably need a heat sink.
The PC107 may need a heat sink depending on the system. This section provides ther-
mal management information for the flip chip plastic ball grid array (FC-PBGA) package
for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design–the heat sink, airflow, and thermal interface material. To reduce the
die-junction temperature, heat sinks may be attached to the package by several meth-
ods–spring clip to holes in the printed-circuit board or package, and mounting clip and
screw assembly (see Figure 7); however, due to the potential large mass of the heat
sink, attachment through the printed-circuit board is suggested. The force of the heat
sink on the die should not exceed 6 lb.
The heat sink surface must be flat without protrusions and must be parallel with the die
as the heat sink is brought into contact to avoid chipping the edges of the die and the
heat sink. Because of the small contact area of the heat sink, it is suggested that the
mounting force be centered over the die.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PC107A | PCI Bridge Memory Controller |
| PC107AMGHU100L | PCI Bridge Memory Controller |
| PC107AMGHU100LC | PCI Bridge Memory Controller |
| PC107AMGHU100LD | PCI Bridge Memory Controller |
| PC107AMZFU100L | PCI Bridge Memory Controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC107AVGHU100LC | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PCI Bridge Memory Controller |
| PC107AVGHU100LD | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PCI Bridge Memory Controller |
| PC107AVZFU100L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PCI Bridge Memory Controller |
| PC107AVZFU100LC | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PCI Bridge Memory Controller |
| PC107AVZFU100LD | 制造商:e2v technologies 功能描述:IC BRIDGE MEM CTRL 100 MHZ - Trays |
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