參數(shù)資料
型號: PC107AVGHU100L
廠商: Atmel Corp.
英文描述: PCI Bridge Memory Controller
中文描述: PCI橋內(nèi)存控制器
文件頁數(shù): 15/50頁
文件大?。?/td> 453K
代理商: PC107AVGHU100L
15
PC107A [Preliminary]
2137C–HIREL–03/04
Figure 6.
Maximum AC Waveforms for 3.3V Signaling
Thermal Information
Package Characteristics
Table 4 provides the package thermal characteristics for the PC107A.
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package
thermal resistance, mounting site (board) temperature, ambient tempera-
ture, airflow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC
JESD51-8. Board temperature is measured on the top surface of the board near the
package.
5. Thermal resistance between the die and the case top surface without thermal grease.
0V
7.1V p-to-p
(Min)
7.1V p-to-p
(Min)
+3.6V
11 ns
(Min)
+7.1V
4 ns
(Max)
4 ns
(Max)
-3.5V
Overvoltage
Waveform
Undervoltage
Waveform
62.5 ns
Table 4.
FC-PBGA Package Thermal Characteristics
Symbol
Characteristic
(1)
Value
Unit
R
θ
JA
Junction-to-ambient natural convection
(1)(2)
(Single-layer board-1s)
30
°
C/W
R
θ
JMA
Junction-to-ambient natural convection
(1)(3)
(Four-layer board-2s2p)
26
°
C/W
R
θ
JMA
Junction-to-ambient (at 200 ft/min)
(1)(3)
(Single-layer board-1s)
25
°
C/W
R
θ
JMA
Junction-to-ambient (at 200 ft/min)
(1)(3)
(Four-layer board-2s2p)
22
°
C/W
R
θ
JB
R
θ
JC
Junction-to-board
(4)
20
°
C/W
Junction-to-case
(5)
< 0.1
°
C/W
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PC107AVGHU100LC 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PCI Bridge Memory Controller
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