參數(shù)資料
型號(hào): P89LPC952FBD,157
廠商: NXP Semiconductors
文件頁(yè)數(shù): 46/69頁(yè)
文件大?。?/td> 0K
描述: IC 80C51 MCU FLASH 8K 44-LQFD
產(chǎn)品培訓(xùn)模塊: Migrating from 8/16-Bit MCUs to 32-Bit ARMs
標(biāo)準(zhǔn)包裝: 800
系列: LPC900
核心處理器: 8051
芯體尺寸: 8-位
速度: 18MHz
連通性: I²C,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 40
程序存儲(chǔ)器容量: 8KB(8K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 512 x 8
電壓 - 電源 (Vcc/Vdd): 2.4 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-LQFP
包裝: 托盤
產(chǎn)品目錄頁(yè)面: 706 (CN2011-ZH PDF)
配用: 622-1016-ND - BOARD FOR P89LPC952FA 44-PLCC
622-1008-ND - BOARD FOR LPC9103 10-HVSON
OM10075-ND - EVAL BOARD FOR LPC952
568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART
568-3510-ND - DEMO BOARD SPI/I2C TO UART
622-1002-ND - USB IN-CIRCUIT PROG LPC9XX
568-1759-ND - EMULATOR DEBUGGER/PROGRMMR LPC9X
其它名稱: 568-2014-5
935280152157
P89LPC952FBD
P89LPC952FDH-S
P89LPC952_954_4
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 24 July 2008
50 of 69
NXP Semiconductors
P89LPC952/954
8-bit microcontroller with 10-bit ADC
9.
Limiting values
[1]
The following applies to Table 10:
a) This product includes circuitry specically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over ambient temperature range unless otherwise specied. All voltages are with respect to VSS unless
otherwise noted.
Table 10.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb(bias)
bias ambient temperature
55
+125
°C
Tstg
storage temperature
65
+150
°C
IOH(I/O)
HIGH-level output current per
input/output pin
-20
mA
IOL(I/O)
LOW-level output current per
input/output pin
-20
mA
II/Otot(max)
maximum total input/output current
-
100
mA
Vn
voltage on any other pin
except VSS, with respect to
VDD
-
3.5
V
Ptot(pack)
total power dissipation (per package)
based on package heat
transfer, not device power
consumption
-
1.5
W
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