參數(shù)資料
型號(hào)： P13683EJ2V0AN00
英文描述： uPC8106. uPC8109 and uPC8163 2.0GHz Silicon Frequency Up-converter ICs for Mobile Communications
中文描述： uPC8106。 uPC8109硅和uPC8163 2.0GHz的頻率上移動(dòng)通信轉(zhuǎn)換器IC
文件頁數(shù)： 6/59頁
文件大?。?/td> 447K
代理商： P13683EJ2V0AN00
Application Note P13683EJ2V0AN00
6
2.
OVERVIEW OF PRODUCTS
2.1 Characteristics and Sizes
The
μ
PC8106 is designed to emphasize low-distortion characteristics and the
μ
PC8109 is designed to emphasize
low current consumption. The
μ
PC8163 is an improved distortion version of the
μ
PC8106. The
μ
PC8106 and
μ
PC8109 have the same pin connections, however the power saving pin is absent in the
μ
PC8163 because it does
not include a power saving function. The supply voltage and frequency band are similarly identical in the
μ
PC8106
and
μ
PC8109, but differ slightly in the
μ
PC8163 (refer to 3.2 Internal Circuit and Frequency Band for details). The
μ
PC8106 and
μ
PC8109 come in 6-pin minimold (2915 size) and 6-pin super minimold (2012 size) packages,
whereas only the latter is available for the
μ
PC8163. T or TB is added to the part number, indicating a conventional
minimold and super minimold package, respectively.
Although products in this series with the same part number use the same circuit configuration, TB products have a
smaller chip size. (By contrast, amplifier series products that have the same part number are all mounted on the
same type of chip). The difference between
μ
PC8106 and
μ
PC8109 in the T and TB products of the
μ
PC8106 and
μ
PC8019 is a conversion gain specification of about 1 dB due to a slight gap in the IF input impedance.
Specifications other than the conversion gain are the same.
A three-character abbreviation is used for the part numbers shown on the products, due to limited marking space
on these small molds. “C2D” indicates the
μ
PC8106, “C2G” indicates the
μ
PC8109 and “C2Y” indicates the
μ
PC8163.
For details of markings, see “Silicon High-frequency Monolithic ICs” (Document No. P10100E) in the selection
guide.
Table 2-1 lists NEC’s lineup of high-frequency up converter ICs. Figure 2-1 shows package drawings of the two
package types.
Table 2-1. NEC’s Lineup of High-Frequency Up Converter ICs
Part
Number
Supply
Voltage
V
CC
(V)
Circuit
Current
I
CC
(mA)
Conversion
Gain 1
CG1 (dB)
Conversion
Gain 2
CG2 (dB)
Saturation RF
Output Power 1
P
O (sat)
1 (dBm)
Saturation RF
Output Power 2
P
O (sat)
2 (dBm)
Output IP
3
1
OIP
3
1(dBm)
Output IP
3
2
OIP
3
2(dBm)
10
7
μ
PC8106T
μ
PC8106TB
2.7 to 5.5
9
9
7
–2
–4
+5.5
+2.0
7
5
–6
–8
μ
PC8109T
μ
PC8109TB
2.7 to 5.5
5
6
4
–5.5
–7.5
+1.5
–1.0
μ
PC8163TB 2.7 to 3.3
16.5
9
5.5
0.5
–2
+9.5
+6.0
Test conditions: T
A
= +25
°
C, V
CC
= V
RFout
= 3.0 V, Z
L
= Z
S
= 50
(
μ
PC8106,
μ
PC8109: V
PS
= 3.0 V)
The above values are typical values for major characteristics. See each product’s data sheet for detailed
characteristics ratings.
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