
PACKAGE MECHANICAL DATA
SOT223 (Plastic)
15
°
(4x)
A
H
I
D
E
F
G
C
B
K
J
L
M
0
°
/7
°
REF.
DIMENSIONS
Millimeters
Min.
Typ. Max. Min.
6.30
6.50
Inches
Typ. Max.
0.256
A
6.70
0.248
0.264
B
6.70
7.00
7.30
0.264
0.275
0.287
C
3.30
3.50
3.70
0.130
0.139
0.146
D
4.60
0.181
E
2.30
0.090
F
2.90
3.00
3.10
0.114
0.118
0.122
G
0.60
0.70
0.80
0.023
0.027
0.031
H
1.50
1.60
1.70
0.059
0.063
0.067
I
0.43
0.45
0.47
0.017
0.018
0.019
J
0.50
0.60
0.70
0.019
0.023
0.027
K
0.63
0.65
0.67
0.024
0.025
0.026
L
0.05
0.002
M
0.32
0.012
Weight: 0.11g
FOOT PRINT
Type
P0102AN
P0102BN
P0102CN
P0102DN
P0111AN
P0111BN
P0111CN
P0111DN
P0109AN
P0109BN
P0109CN
P0109DN
Marking
P2A
P2B
P2C
P2D
P1A
P1B
P1C
P1D
P9A
P9B
P9C
P9D
MARKING
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability forthe
consequences of use of such information nor for any infringement of patentsor other rights of thirdparties which may result from its use. No
license is granted by implication orotherwise under any patent orpatent rightsof SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subjectto change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSONMicroelectronics products are notauthorized foruseas critical components inlife supportdevices or systems withoutexpress
written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
1.5
1.5
3.3
1.2
2.3
(3x)
4.6
6.4
Recommended soldering pattern SOT223
P01xxxN
5/5