參數(shù)資料
型號: NX25P16-VSI
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 FLASH 2.7V PROM, PDSO8
封裝: 0.208 INCH, SOIC-8
文件頁數(shù): 18/43頁
文件大?。?/td> 918K
代理商: NX25P16-VSI
W25P80 / W25P16 / W25P32
Publication Release Date: December 11, 2005
- 25 -
Revision J
9.2.13 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 16. The Device ID values for the W25P80, W25P16 and W25P32 are listed in
Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device
ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can
be read continuously, alternating from one to the other. The instruction is completed by driving /CS
high.
Figure 16. Read Manufacturer / Device ID Diagram
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