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參數(shù)資料
| 型號： | NIS3001 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
| 中文描述： | 集成驅(qū)動器和MOSFET功率芯片的同步降壓控制器 |
| 文件頁數(shù)： | 15/18頁 |
| 文件大?。?/td> | 208K |
| 代理商： | NIS3001 |
NIS3001
http://onsemi.com
15
as shown in Figure 20. Dividing the larger die pads into
smaller screen openings reduces the risk of solder voiding
and allows the solder joints for the smaller terminal pads to
be at the same height as the larger ones.
Package Placement onto the PCB
Pick and place equipment with the standard tolerance of
±
0.05 mm or better is recommended. The package will
tend to center itself and correct for slight placement errors
during the reflow process due to the surface tension of the
solder.
Figure 20. Solder stencil design illustrating smaller
stencil openings over the larger exposed die pads.
0.789
12X
1.000
2X
0.356
1.015
0.700
Die Attach
Pads
0.928
1.856
8X
1.621
4X
Solder Reflow
Once the package is placed on the PC board along with
the solder paste, a standard surface mount reflow process
can be used to mount the part. Figure 21 is an example of
a standard reflow profile. The exact profile will be
determined, and is available, by the manufacture of the
paste since the chemistry and viscosity of the flux matrix
will vary. These variations will require small changes in
the profile in order to achieve an optimized process.
Figure 21. Typical reflow profile for eutectic tin/lead
solder.
In general, the temperature of the part should be raised
not more than 2
°
C/sec during the initial stages of the reflow
profile. The soak zone then occurs when the part is
approximately 150
°
C and should last for 30 to 120 seconds.
Typically, extending the time in the soak zone will reduce
the risk of voiding within the solder. The temperature is
then raised and will be above the liquidus of the solder for
30 to 100 seconds depending on the mass of the board. The
peak temperature of the profile should be between 205 and
225
°
C for eutectic Sn/Pb solder.
If required, removal of the residual solder flux can be
completed by using the recommended procedures set forth
by the flux manufacturer.
T
(30 to 120 sec)
Less than
2
°
C/sec
Peak of 225
°
C
Time
Above
250
200
183
150
100
50
0
500
400
300
200
100
0
Time (sec)
Final Solder Inspection
The inspection of the solder joints is commonly
performed with the use of an Xray inspection system.
With this tool, one can locate defects such as shorts
between pads, open contacts, voids within the solder as
well as any extraneous solder.
In addition to searching for defects, the mounted device
should be rotated on its side to inspect the sides of the solder
joints with an Xray inspection system. The solder joints
should have enough solder volume with the proper
standoff height so that an “Hour Glass” shaped connection
is not formed as shown below in Figure 22. “Hour Glass”
solder joints are a reliability concern and must be avoided.
Figure 22. Side view of NIS3001 illustrating
preferred and undesirable solder joints.
Undesirable
“Hour Glass”
Preferred
Solder Joint
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NIS3001/D | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS3001A/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS3001QPT1 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS5101 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:SMART HotPlug IC/Inrush Limiter/Circuit Breaker |
| NIS5101-D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Smart Hot Plug?IC/Inrush Limiter/Circuit Breaker |
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