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參數(shù)資料
| 型號： | NIS3001 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
| 中文描述： | 集成驅(qū)動器和MOSFET功率芯片的同步降壓控制器 |
| 文件頁數(shù)： | 14/18頁 |
| 文件大?。?/td> | 208K |
| 代理商： | NIS3001 |
NIS3001
http://onsemi.com
14
Figure 19. Recommended PCB Layout for NIS3001 footprint
NIS3001 Footprint
Recommended PCB Pattern for NIS3001 Footprint
0.789
12X
2.169
2X
1.612
3.096
4X
3.439
3.261
1.612
1.689
0.356
4X
1.612
4.568
0.789
0.356
3.658
1.612
3.261
9.840
6.592
Thermal/Electrical Vias
Vias are normally placed on the larger die attach pads to
improve electrical and thermal performance. If vias are
required on the larger die attach pads, our recommendation
is to use filledvias. Filledvias will help prevent the solder
from flowing down into the holes, thereby reducing the
solder volume required for the solder joint of this die attach
pad. Filledvias are normally filled with some type of
conductive epoxy.
If throughhole vias are used, we recommend that the via
size be less than or equal to 0.25mm(10 mils). The number
of vias placed over the die attach pad is also critical and
should not exceed 25% of the total exposed area of the
copper pattern. In other words, excessive throughhole
vias will allow the solder to flow down into the via and
thereby decrease the solder volume needed to have a
sufficient solder joint. These vias can be plugged with
solder mask material to avoid soldering wicking.
NIS3001 Board Mounting Process
The board mounting process is optimized by first
defining and controlling the following processes:
1. Creating and maintaining a solderable
metallization on the PCB contacts.
2. Choosing the proper solder paste.
3. Screening/stenciling the solder paste onto the
PCB.
4. Placing the package onto the PCB.
5. Reflowing the solder paste.
6. Final solder joint inspection.
Recommendations for each of these processes are
located below.
PCB Solderable metallization
There are two common plated solderable metallizations,
which are used for PCB surface mount devices. In either
case, it is imperative that the plating is uniform,
conforming, and free of impurities to insure a consistent
solderable system.
The first metallization consists of an Organic
Solderability Preservative coating (OSP) over the copper
plated pad. The organic coating assists in reducing
oxidation in order to preserve the copper metallization for
soldering.
The second recommended solderable metallization
consists of plated electroless nickel over the copper pad,
followed by immersion gold. The thickness of the
electroless nickel layer is determined by the allowable
internal material stresses and the temperature excursions
the board will be subjected to throughout its lifetime. Even
though the gold metallization is typically a selflimiting
process, the thickness should be at least 0.05 mm thick, and
not consist of more than 5% of the overall solder volume.
Having excessive gold in the solder joint can create gold
embitterment which may affect the reliability of the joint.
Solder Type
Solder paste such as Cookson Electronics’ WS3060 with
a Type 3 or smaller sphere size is recommended. The
WS3060 has a watersoluble flux for cleaning. Cookson
Electronics’ PNC0106A can be used if a noclean flux is
preferred.
Solder Screening onto the PCB
Stencil screening the solder onto the PCB board is
commonly used in the industry. The recommended stencil
thickness to be used is 0.075 mm (0.003 in) and the
sidewalls of the stencil openings should be tapered
approximately 5 degrees to facilitate the release of the
paste when the stencil is removed from the PCB. Note that
a 0.127 mm (0.005 in) thick stencil may be used also, but
will require smaller stencil openings to reduce the amount
of solder applied to equal the amount of solder applied
using the 0.075 mm thick stencil.
For a typical edge PCB terminal pad, the stencil opening
should be the same size as the pad size on the package.
However, in cases where the die pad is soldered to the PCB,
the stencil opening must be divided into smaller openings
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NIS3001/D | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS3001A/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS3001QPT1 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
| NIS5101 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:SMART HotPlug IC/Inrush Limiter/Circuit Breaker |
| NIS5101-D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Smart Hot Plug?IC/Inrush Limiter/Circuit Breaker |
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