參數(shù)資料
型號(hào): MTP3N25E
廠商: MOTOROLA INC
元件分類(lèi): JFETs
英文描述: TMOS POWER FET 3.0 AMPERES 250 VOLTS RDS(on) = 1.4 OHM
中文描述: 3 A, 250 V, 1.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
文件頁(yè)數(shù): 2/8頁(yè)
文件大?。?/td> 208K
代理商: MTP3N25E
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(TJ = 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250
μ
Adc)
Temperature Coefficient (Positive)
V(BR)DSS
367
Vdc
mV/
°
C
Zero Gate Voltage Drain Current
(VDS = 250 Vdc, VGS = 0 Vdc)
(VDS = 250 Vdc, VGS = 0 Vdc, TJ = 125
°
C)
Gate–Body Leakage Current (VGS =
±
20 Vdc, VDS = 0)
IDSS
10
100
μ
Adc
IGSS
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250
μ
Adc)
Temperature Coefficient (Negative)
VGS(th)
2.0
6.0
4.0
Vdc
mV/
°
C
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 1.5 Adc)
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 3.0 Adc)
(ID = 1.5 Adc, TJ = 125
°
C)
RDS(on)
VDS(on)
1.1
1.4
Ohm
3.5
5.04
4.41
Vdc
Forward Transconductance (VDS = 15 Vdc, ID = 1.5 Adc)
gFS
1.0
1.8
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
f = 1.0 MHz)
Ciss
Coss
Crss
307
430
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
57
75
Reverse Transfer Capacitance
14
25
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
RG = 4.7
)
td(on)
tr
td(off)
tf
7.0
15
ns
Rise Time
(VDD = 125 Vdc, ID = 3.0 Adc,
VGS = 10 Vdc,
5.0
15
Turn–Off Delay Time
15
30
Fall Time
6.0
15
Gate Charge
(See Figure 8)
VGS = 10 Vdc)
QT
Q1
Q2
Q3
9.8
15
nC
(VDS = 200 Vdc, ID = 3.0 Adc,
2.1
4.2
3.8
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 3.0 Adc, VGS = 0 Vdc)
(IS = 3.0 Adc, VGS = 0 Vdc, TJ = 125
°
C)
VSD
0.9
0.728
1.6
Vdc
Reverse Recovery Time
(See Figure 14)
dIS/dt = 100 A/
μ
s)
trr
153
ns
(IS = 3.0 Adc, VGS = 0 Vdc,
ta
tb
64
89
Reverse Recovery Stored Charge
QRR
0.51
μ
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25
from package to center of die)
LD
3.5
4.5
nH
Internal Source Inductance
(Measured from the source lead 0.25
from package to source bond pad)
LS
7.5
nH
(1) Pulse Test: Pulse Width
300
μ
s, Duty Cycle
2%.
(2) Switching characteristics are independent of operating junction temperature.
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